September 5-8, 2017
Hotel Novotel München City
Munich, Germany
Christinel Ababei
Marquette University, USA
Xiaosen Liu
Intel, USA
Mohammad Abbasi
Intel Corporation (UK) Ltd
Xilin Liu
University of Pennsylvania, USA
Aisha Abdallah
University of Sharjah, UAE
Zhonghai Lu
KTH Royal Institute of Technology, Sweden
Emrah Acar
CLK Design Automation, USA
Gin-Kou Ma
ITRI, Taiwan
Kenichi Agawa
Toshiba, Japan
Martin Margala
University of Massachusetts Lowell, USA
Ali Ahmadinia
California State University San Marcos, USA
Andrew Marshall
University of Texas at Dallas, USA
Massimo Alioto
National University of Singapore, Singapore 
Pascal Meinerzhagen
Intel, USA
Richard Auletta
Independent Consulting Engineer, USA
Ning Mi
Cadence Design Systems, USA
Jürgen Becker
Karlsruhe Institute of Technology, Germany
Baker Mohammad
Khalifa University, United Arab Emirates (UAE)
Karan Bhatia
Texas Instruments, USA
Venki Muthukumar
University of Nevada Las Vegas, USA
Thomas Büchner
IBM, Germany
Nagi Naganathan
Broadcom, USA
Andreas Burg
EPFL, Switzerland
Tobias Noll
RWTH Aachen University, Germany
Sumer Can
Diodes, Inc., USA
Maurizio Palesi
Kore University, Italy
Hung-Ming Chen
National Chiao Tung University, Taiwan
Viral Parikh
Cirrus Logic, USA
Jifeng Chen
Freescale Semiconductor, USA
Viral Parikh
Cirrus Logic, USA
Poki Chen
National Taiwan University of Science and Technology
Vasileios Pavlidis
University of Manchester, UK
Ren Chen
University of Southern California, USA
Sandip Ray
NXP, USA
Sao-Jie Chen
National Taiwan University, Taiwan
Fakhrul Zaman Rokhani
University Putra, Malaysia
Xiang Chen
George Mason University, USA

Chris Ryan
Maxim Integrated Inc., USA
Won Ho Choi
Western Digital, USA
Ulf Schlichtmann
Technische Universität München, Germany
Masoud Daneshtalab
KTH Royal Institute of Technology
Mark Schrader
iLUMENATi LLC, USA
Kamal El-Sankary
Dalhousie University, Canada
Norbert Schuhmann
Fraunhofer IIS, Germany
Eby Friedman
University of Rochester, USA
Giuseppe Scotti
University of Rome "La Sapienza", Italy
Fabio Frustaci
University of Calabria, Italy
Radu Secareanu
NXP, USA
Na Gong
North Dakota State University, USA
Sakir Sezer
Queen's University Belfast, UK
Mohit Gupta
KU Leuven, Belgium
Ritu Raj Singh
InSilixa, USA
David Harris
Harvey Mudd College, USA
Hongjiang Song
Intel, USA
Tsung-Yi Ho
National Tsing Hua University, Taiwan
Ramalingam Sridhar
SUNY at Buffalo, USA
Jianyun Hu
Qualcomm, USA
Huseyin Sumbul
Intel, USA
Miao Hu
HP Enterprise, USA
Guangyu Sun
Peking University, China
Po-Tsang Huang
National Chiao-Tung University, Taiwan
Pinping Sun
IEEE, USA
Yu Huang
Mentor Graphics, USA
Krishnan Sundaresan
Qualcomm Inc., USA
Yuan-Hao Huang
National Tsing Hua University, Taiwan
Vikram Suresh
Intel, USA
William Hung
Synopsys, USA
Armin Tajalli
EPFL, Switzerland
Mohsen Imani
University of California San Diego, USA
Himanshu Thapliyal
University of Kentucky, USA
Tohru Ishihara
Kyoto University, Japan
Nozomu Togawa
Waseda University, Japan
Hailong Jiao
Eindhoven University of Technology, Netherlands
Upasna Vishnoi
Marvell Semiconductor Inc, USA
Yier Jin
University of Central Florida, USA
Haibo Wang
Southern Illinois University Carbondale, USA
Suhwan Kim
Seoul National University, Korea
Jinhui Wang
North Dakota State University, USA
Phil Knag
Intel, USA
Lei Wang
University of Connecticut, USA
Ram Krishnamurthy
Intel, USA
Zhongfeng Wang
Nanjing University, China
Dhireesha Kudithipudi
Rochester Institute of Technology, USA
Wujie Wen
Florida International University, USA
Raghavan Kumar
Intel, USA
Yuejian Wu
Infinera, USA
Rajesh Kumar
Qualcomm, USA
Cole Zemke
Globalfoundries, USA
Bo-Cheng Lai
National Chiao-Tung University, Taiwan
Danella Zhao
Old Dominion University, USA
Marco Lanuzza
Universita' della Calabria, Italy
Shuang Zhu
Qualcomm, USA
Luciano Lavagno
Politecnico di Torino, Italy
 
Bing Li
Tech­nische Univer­sität München, Germany
 
Helen Li
Duke University, USA
 
Chenchen Liu
Clarkson University, USA
 
Peng Liu
Zhejiang University, China
 

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