September 4-7, 2018
Crystal City Marriott Hotel
Arlington, VA (Washington, DC)
Christinel Ababei
Marquette University, USA
Xiaosen Liu
Intel, USA
Aisha Abdallah
University of Sharjah, UAE
Xilin Liu
University of Pennsylvania, USA
Emrah Acar
CLK Design Automation, USA
Zhonghai Lu
KTH Royal Institute of Technology, Sweden
Kenichi Agawa
Toshiba, Japan
Gin-Kou Ma
ITRI, Taiwan
Ali Ahmadinia
California State University San Marcos, USA
Andrew Marshall
University of Texas at Dallas, USA
Massimo Alioto
National University of Singapore, Singapore 
Pascal Meinerzhagen
Intel, USA
Richard Auletta
Independent Consulting Engineer, USA
Baker Mohammad
Khalifa University, United Arab Emirates (UAE)
 
Jürgen Becker
Karlsruhe Institute of Technology, Germany
Venki Muthukumar
University of Nevada Las Vegas, USA
Karan Bhatia
Texas Instruments, USA
Nagi Naganathan
Broadcom, USA
Thomas Büchner
IBM, Germany
Tobias Noll
RWTH Aachen University, Germany
Andreas Burg
EPFL, Switzerland
Maurizio Palesi
University of Catania, Italy
Hung-Ming Chen
National Chiao Tung University, Taiwan
Viral Parikh
Cirrus Logic, USA
Poki Chen
National Taiwan University of Science and Technology
Vasileios Pavlidis
University of Manchester, UK
Ren Chen
University of Southern California, USA
Sandip Ray
NXP, USA
Sao-Jie Chen
National Taiwan University, Taiwan
Fakhrul Zaman Rokhani
University Putra, Malaysia
Xiang Chen
George Mason University, USA

Chris Ryan
Maxim Integrated Inc., USA
Won Ho Choi
Western Digital, USA
Mark Schrader
iLUMENATi LLC, USA
Masoud Daneshtalab
KTH Royal Institute of Technology
Norbert Schuhmann
Fraunhofer IIS, Germany
Kamal El-Sankary
Dalhousie University, Canada
Giuseppe Scotti
University of Rome "La Sapienza", Italy
Fabio Frustaci
University of Calabria, Italy
Radu Secareanu
NXP, USA
Na Gong
North Dakota State University, USA
Sakir Sezer
Queen's University Belfast, UK
Mohit Gupta
KU Leuven, Belgium
Ritu Raj Singh
InSilixa, USA
Tsung-Yi Ho
National Tsing Hua University, Taiwan
Hongjiang Song
Intel, USA
Chunhua Hu
Texas Instruments, USA
Ramalingam Sridhar
SUNY at Buffalo, USA
Jianyun Hu
Qualcomm, USA
Huseyin Sumbul
Intel, USA
Miao Hu
Binghamton University, USA
Pinping Sun
IEEE, USA
Po-Tsang Huang
National Chiao-Tung University, Taiwan
Krishnan Sundaresan
Qualcomm Inc., USA
Yu Huang
Mentor Graphics, USA
Vikram Suresh
Intel, USA
Yuan-Hao Huang
National Tsing Hua University, Taiwan
Himanshu Thapliyal
University of Kentucky, USA
Mohsen Imani
University of California San Diego, USA
Nozomu Togawa
Waseda University, Japan
Tohru Ishihara
Kyoto University, Japan
Upasna Vishnoi
Marvell Semiconductor Inc, USA
Bo Jiang
OmniVision Technologies, USA
Haibo Wang
Southern Illinois University Carbondale, USA
Hailong Jiao
Eindhoven University of Technology, Netherlands
Jinhui Wang
North Dakota State University, USA
Yier Jin
University of Florida, USA
Lei Wang
University of Connecticut, USA
Suhwan Kim
Seoul National University, Korea
Zhongfeng Wang
Nanjing University, China
Phil Knag
Intel, USA
Wujie Wen
Florida International University, USA
Ram Krishnamurthy
Intel, USA
Maruthi Yogeesh
University of Texas at Austin, USA
Raghavan Kumar
Intel, USA
Cole Zemke
Globalfoundries, USA
Rajesh Kumar
Qualcomm, USA
Danella Zhao
Old Dominion University, USA
Bo-Cheng Lai
National Chiao-Tung University, Taiwan
Shuang Zhu
Qualcomm, USA
Marco Lanuzza
Universita' della Calabria, Italy
 
Luciano Lavagno
Politecnico di Torino, Italy
 
Bing Li
Tech­nische Univer­sität München, Germany
 
Helen Li
Duke University, USA
 
Chenchen Liu
Clarkson University, USA
 

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