37th IEEE International
System-on-Chip
Conference
Dresden, Germany
September 16-19, 2024
Proceedings available at IEEE Xplore
Thank you for visiting
IEEE SOCC 2024
We hope that you have enjoyed the conference,
and that we will see you again next year at SOCC 2025
Please watch this site for updated information.
Your SOCC Organizing Team
Meet us in Dresden
The 37th SOCC offers a three days technical program including keynote and plenary speeches, oral and poster presentations, hot-topic panel sessions, and one day of tutorials and industrial talks.
In addition, SOCC has a long tradition of high-class social events complementing the technical program, helping you to discuss your work with your colleagues, and enhancing your professional network.
Stay on top of SoC research
System-on-Chip (SoC) and System-in-Package (SiP) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC). Such systems will provide solutions in communication, entertainment, medical and smart mobility technologies underpinning emerging “Digital Societies”. Recent advances in systems, packaging and process technologies are enabling the computation of hundreds of teraflops per chip and chiplet system integration unleashing the massive rise of AI-based edge devices, various accelerators, new products and applications. This enormous demand for computing per silicon-based SoC and SiP integration creates new challenges with respect to storage, memory, security, reliability, power, on- and off-chip communication, packaging including reliable design and verification.
37 years of excellence
For more than 36 years the IEEE International System-on-Chip Conference (SOCC) has been a premier forum for sharing latest advancements in SoC architectures, systems, logic and circuit design, process technology, test, design tools, and application scenarios. We consequently continue this tradition with the 2024 conference at the heart of “Silicon Saxony” in Dresden, Germany.
Meet the Experts
Enhance your professional network
Distinguished Speakers
Infineon Technologies AG
University of Kaiserslautern-Landau
Head of Sales,
and President of Automotive
SiMa.ai
Dept. of Information Technology
and Electrical Engineering
ETH Zurich
Department of Electrical & Computer Engineering
University of Massachusetts Amherst
Robert Bosch GmbH