39th IEEE International
System-on-Chip
Conference

Heidelberg, Germany

Sep. 30 - Oct. 2, 2026

Stay on top of SoC research

System-on-Chip (SoC) and System-in-Package (SiP) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC). Such systems will provide solutions in communication, entertainment, medical and smart mobility technologies underpinning emerging “Digital Societies”. Recent advances in systems, packaging and process technologies are enabling the computation of hundreds of teraflops per chip and chiplet system integration unleashing the massive rise of AI-based edge devices, various accelerators, new products and applications. This enormous demand for computing per silicon-based SoC and SiP integration creates new challenges with respect to storage, memory, security, reliability, power, on- and off-chip communication, packaging including reliable design and verification.

39 years of excellence

For more than 38 years the IEEE International System-on-Chip Conference (SOCC) has been a premier forum for sharing latest advancements in SoC architectures, systems, logic and circuit design, process technology, test, design tools, and application scenarios. We consequently continue this tradition with the 2026 conference in Heidelberg.

Meet the Experts

Join our top ranking international keynote and plenary speakers presenting and discussing the latest developments in the field.

Enhance your professional network

During our social events you get the unique chance to exchange your knowledge face-to-face with colleagues from all over the world.

Meet the world in Heidelberg

Photo: Eckhard Henkel / Wikimedia Commons / CC BY-SA 3.0 DE

Welcome to Heidelberg - where history meets future technology.

Heidelberg is a city where centuries of tradition and cutting-edge innovation coexist in perfect balance.
Framed by its iconic Heidelberg Castle and historic Old Bridge, the city’s rich cultural and academic heritage provides the foundation for forward-looking research and technological excellence.
Renowned institutions like Heidelberg University, the German Cancer Research Center (DKFZ), and the Heidelberg Institute for Theoretical Studies drive breakthroughs in science, medicine, and AI.
Innovative startups and tech hubs, such as those in the Heidelberg Technology Park and the Heidelberg Innovation Park, are shaping solutions for tomorrow—from biomedical advancements to digital transformation—while honoring the past.
In Heidelberg, timeless architecture and visionary ideas come together to create a place where history inspires the future.

The 39th IEEE System-on-Chip Conference offers a three days technical program including keynote and plenary speeches, oral and poster presentations, hot-topic panel sessions, tutorials and industrial talks.

In addition, SOCC has a long tradition of high-class social events complementing the technical program, helping you to discuss your work with your colleagues from all over the world, and enhancing your professional network.

39th IEEE International System-on-Chip Conference