37th IEEE International
System-on-Chip
Conference

Dresden, Germany

September 16-19, 2024

Call for Student Participation Grants

We are pleased to announce the availability of a number of Student Participation Grants for the IEEE SOCC 2024 conference. Supported in part by the National Science Foundation, these competitive grants for students from US institutions aim to help offset the costs associated with attending and participating in the conference. Each grant, $500 to $1000, can be used to cover expenses such as travel, registration, and lodging.

Purpose of the Grants

These grants are intentionally termed Participation Grants rather than Travel or Attendance Grants. They are designed to support students' active involvement in conference activities throughout the entire event. This includes attending technical presentations, giving lectures, participating in tutorials, and interacting with other participants during breaks and organized activities.

Eligibility and Preferences

Eligibility: Only authors, presenters, and just attending students from US institutions are eligible to apply. For the purposes of these grants, a student is defined as anyone currently enrolled or who was a student when the presented work was conducted..

Application Process

To apply, students must submit:

A completed application form and email it to Dr. Magdy Bayoumi.
A personal statement (up to 500 words) detailing their interest in SOCC 2024 and how participation will benefit their academic and career goals.
A supporting letter from the advisor

If you have any questions regarding the grants or application form, please feel free to contact Dr. Magdy Bayoumi: magdy1112@yahoo.com

The deadline for full consideration is August 31st, but later applications will be considered if all grants are not awarded by those received by the full consideration deadline.

Meet us in Dresden

The 37^th SOCC offers a three days technical program including keynote and plenary speeches, oral and poster presentations, hot-topic panel sessions, and one day of tutorials and industrial talks.

In addition, SOCC has a long tradition of high-class social events complementing the technical program, helping you to discuss your work with your colleagues, and enhancing your professional network.

Stay on top of SoC research

System-on-Chip (SoC) and System-in-Package (SiP) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC). Such systems will provide solutions in communication, entertainment, medical and smart mobility technologies underpinning emerging “Digital Societies”. Recent advances in systems, packaging and process technologies are enabling the computation of hundreds of teraflops per chip and chiplet system integration unleashing the massive rise of AI-based edge devices, various accelerators, new products and applications. This enormous demand for computing per silicon-based SoC and SiP integration creates new challenges with respect to storage, memory, security, reliability, power, on- and off-chip communication, packaging including reliable design and verification.

37 years of excellence

For more than 36 years the IEEE International System-on-Chip Conference (SOCC) has been a premier forum for sharing latest advancements in SoC architectures, systems, logic and circuit design, process technology, test, design tools, and application scenarios. We consequently continue this tradition with the 2024 conference at the heart of “Silicon Saxony” in Dresden, Germany.